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Freescale Semiconductor Technical Data
MPXV5004G Rev. 6, 10/2004
Integrated Silicon Pressure Sensor On- Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXV5004G series piezoresistive transducer is a state--of--the--art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin--film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * Temperature Compensated over 10 to 60C * Available in Gauge Surface Mount (SMT) or Through-hole (DIP) Configurations * Durable Thermoplastic (PPS) Package Application Examples * Washing Machine Water Level * Ideally Suited for Microprocessor or Microcontroller-Based Systems
MPXV5004G6U CASE 482 SMALL OUTLINE PACKAGE SURFACE MOUNT
MPXV5004G SERIES
INTEGRATED PRESSURE SENSOR 0 to 3.92 kPa (0 to 400 mm H2O) 1.0 to 4.9 V OUTPUT
SMALL OUTLINE PACKAGE THROUGH-HOLE
MPXV5004GC7U CASE 482C
VS
MPXV5004GC6U CASE 482A
SENSING ELEMENT THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY Vout
J
MPXV5004G7U CASE 482B MPXV5004GP CASE 1369 1 2 3 4 MPXV5004DP CASE 1351
GND
PINS 1, 5, 6, 7, AND 8 ARE NO CONNECTS FOR SMALL OUTLINE PACKAGE DEVICE
Figure 1. Fully Integrated Pressure Sensor Schematic
PIN NUMBER
N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C
NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
MPXV5004GVP CASE 1368
(c) Freescale Semiconductor, Inc., 2004. All rights reserved.
MPXV5004G SERIES 1
Sensor Device Data Freescale Semiconductor
MAXIMUM RATINGS(NOTE)
Parametrics Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 16 --30 to +100 0 to +85 Unit kPa C C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications)
Characteristic Pressure Range Supply Voltage(1) Supply Current Span at 306 mm H2O (3 kPa)(2) Offset(3)(5) Sensitivity Accuracy(4)(5) 0 to 100 mm H2O 100 to 400 mm H2O (10 to 60C) (10 to 60C) Symbol POP VS IS VFSS Voff V/P -- Min 0 4.75 -- -- 0.75 -- -- Typ -- 5.0 -- 3.0 1.00 1.0 9.8 -- Max 3.92 400 5.25 10 -- 1.25 -- 1.5 2.5 Unit kPa mm H2O Vdc mAdc V V V/kPa mV/mm H2O %VFSS %VFSS
NOTES: 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * Offset Stability: Output deviation, after 1000 temperature cycles, -30 to 100C, and 1.5 million pressure cycles, with minimum rated pressure applied. * TcSpan: Output deviation over the temperature range of 10 to 60C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of 5 C between autozero and measurement.
MPXV5004G SERIES 2 Sensor Device Data Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by integrating the shear--stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV5004G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long--term reliability. Internal reliability and qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the MPXV5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10C to 60C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.
FLUOROSILICONE GEL DIE COAT P1 WIRE BOND
DIE
STAINLESS STEEL CAP
+5 V
Vout Vs IPS OUTPUT
THERMOPLASTIC CASE
LEAD FRAME
1.0 mF P2 DIFFERENTIAL SENSING ELEMENT DIE BOND
0.01 mF
GND
470 pF
Figure 2. Cross-Sectional Diagram (Not to Scale)
Figure 3. Recommended power supply decoupling and output filtering. For additional output filtering, please refer to Application Note AN1646.
5.0
TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] 1.5% VFSS VS = 5.0 V 0.25 Vdc 4.0 TEMP = 10 to 60C OUTPUT (V) TYPICAL MAX 2.0 MIN
3.0
1.0
2 kPa 200 mm H2O DIFFERENTIAL PRESSURE
4 kPa 400 mm H2O
Figure 4. Output versus Pressure Differential
(See Note 5 in Operating Characteristics)
MPXV5004G SERIES Sensor Device Data Freescale Semiconductor 3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The
Part Number MPXV5004GC6U/T1 MPXV5004G6U/T1 MPXV5004GC7U MPXV5004G7U MPXV5004GP MPXV5004DP MPXV5004GVP Case Type 482A 482 482C 482B 1369 1351 1368
Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below:
Pressure (P1) Side Identifier Side with Port Attached Stainless Steel Cap Side with Port Attached Stainless Steel Cap Side with Port Attached Side with Port Marking Stainless Steel Cap
ORDERING INFORMATION MPXV5004G series pressure sensors are available in the basic element package or with a pressure port. Two packing options are offered for the surface mount configuration.
Device Type / Order No No. MPXV5004G6U MPXV5004G6T1 MPXV5004GC6U MPXV5004GC6T1 MPXV5004GC7U MPXV5004G7U MPXV5004GP MPXV5004DP MPXV5004GVP Case No No. 482 482 482A 482A 482C 482B 1369 1351 1368 Rails Tape and Reel Rails Tape and Reel Rails Rails Trays Trays Trays Packing Options Device Marking MPXV5004G MPXV5004G MPXV5004G MPXV5004G MPXV5004G MPXV5004G MPXV5004G MPXV5004G MPXV5004G
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct
0.660 16.76
fottprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
0.100 TYP 8X 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482) MPXV5004G SERIES 4 Sensor Device Data Freescale Semiconductor
NOTES
MPXV5004G SERIES Sensor Device Data Freescale Semiconductor 5
NOTES
MPXV5004G SERIES 6 Sensor Device Data Freescale Semiconductor
SMALL OUTLINE PACKAGE DIMENSIONS
--A5 4
D 8 PL 0.25 (0.010)
M
TB
S
A
S
--B8
G
1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 10.29 10.54 18.01 18.41
S N C
PIN 1 IDENTIFIER
J K M
H --TSEATING PLANE
CASE 482-01 ISSUE O
--A5 4
D 8 PL 0.25 (0.010)
M
TB
S
A
S
N--B8
G
1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C J K M
PIN 1 IDENTIFIER
H --TSEATING PLANE
CASE 482A-01 ISSUE A
MPXV5004G SERIES Sensor Device Data Freescale Semiconductor 7
SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
--A5 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM A B C D G J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.210 0.220 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.405 0.415 0.540 0.560 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.33 5.59 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 10.29 10.54 13.72 14.22
--B8
G
1
0.25 (0.010)
M
TB
D 8 PL SA
S
S N C
PIN 1 IDENTIFIER
DETAIL X
--TK M J DETAIL X
SEATING PLANE
CASE 482B-03 ISSUE B
--A5 4
N--B8
G
1
0.25 (0.010)
M
TB
D 8 PL SA
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. S DIM A B C D G J K M N S V W SEATING PLANE INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17
S
DETAIL X W
V C
PIN 1 IDENTIFIER
--TK M J DETAIL X
CASE 482C-03 ISSUE B
MPXV5004G SERIES 8 Sensor Device Data Freescale Semiconductor
SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
2 PLACES 4 TIPS
0.008 (0.20) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35) L DETAIL G A1
D
8
1 8X
F
b 0.004 (0.1)
M
CAB
B
E1
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M--1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.300 0.330 0.002 0.010 0.038 0.042 0.465 0.485 0.717 BSC 0.465 0.485 0.100 BSC 0.245 0.255 0.120 0.130 0.061 0.071 0.270 0.290 0.080 0.090 0.009 0.011 0.115 0.125 0 7 MILLIMETERS MIN MAX 7.11 7.62 0.05 0.25 0.96 1.07 11.81 12.32 18.21 BSC 11.81 12.32 2.54 BSC 6.22 6.47 3.05 3.30 1.55 1.80 6.86 7.36 2.03 2.28 0.23 0.28 2.92 3.17 0 7
T
N K
A
8X
M
P
0.004 (0.1) C
SEATING PLANE
DETAIL G
CASE 1369-01 ISSUE O
MPXV5004G SERIES Sensor Device Data Freescale Semiconductor 9
SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
2 PLACES 4 TIPS
0.006 (0.15) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35) L DETAIL G A1
D
8
1 8X
F
b 0.004 (0.1)
M
CAB
B
E1
STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8.
GND +Vout Vs --Vout N/C N/C N/C N/C
STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8.
N/C Vs GND Vout N/C N/C N/C N/C
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M--1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.370 0.390 0.002 0.010 0.038 0.042 0.465 0.485 0.680 0.700 0.465 0.485 0.100 BSC 0.240 0.260 0.115 0.135 0.040 0.060 0.270 0.290 0.160 0.180 0.009 0.011 0.110 0.130 0 7 MILLIMETERS MIN MAX 9.39 9.91 0.05 0.25 0.96 1.07 11.81 12.32 17.27 17.78 11.81 12.32 2.54 BSC 6.10 6.60 2.92 3.43 1.02 1.52 6.86 7.37 4.06 4.57 0.23 0.28 2.79 3.30 0 7
N
T
A
M
P
8X
0.004 (0.1) C
SEATING PLANE
DETAIL G
K
CASE 1351-01 ISSUE O
MPXV5004G SERIES 10 Sensor Device Data Freescale Semiconductor
SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
2 PLACES 4 TIPS
0.006 (0.15) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35) L DETAIL G A1
D
8
1 8X
F
b 0.004 (0.1)
M
CAB
B
E1
STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8.
GND +Vout Vs --Vout N/C N/C N/C N/C
STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8.
N/C Vs GND Vout N/C N/C N/C N/C
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M--1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T R INCHES MIN MAX 0.280 0.300 0.002 0.010 0.038 0.042 0.465 0.485 0.690 BSC 0.465 0.485 0.100 BSC 0.240 0.260 0.115 0.135 0.040 0.060 0.035 0.055 0.075 0.095 0.009 0.011 0.110 0.130 0.405 0.415 0 7 MILLIMETERS MIN MAX 7.11 7.62 0.05 0.25 0.96 1.07 11.81 12.32 17.52 BSC 11.81 12.32 2.54 BSC 6.10 6.60 2.92 3.43 1.02 1.52 1.90 2.41 0.89 1.39 0.23 0.28 2.79 3.30 10.28 10.54 0 7
N T K
R
A
8X
P
0.004 (0.1) C
SEATING PLANE
DETAIL G
M
CASE 1368-01 ISSUE O
MPXV5004G SERIES Sensor Device Data Freescale Semiconductor 11
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MPXV5004G Rev. 6 10/2004
MPXV5004G SERIES 12 Sensor Device Data Freescale Semiconductor

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